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Placement & Routing
Component grouping, routing strategy and layer usage.
Our workflow considers board complexity, electrical needs, mechanical constraints and manufacturing goals.
Component grouping, routing strategy and layer usage.
Clearance, width, via and fabricator-specific rule checks.
Board outline, mounting points and connector access.
Review stated signal, power, grounding and thermal constraints.
Agreed Gerber, drill, assembly and BOM documentation.
Organised deliverables and review notes for manufacturing partners.
Agree requirements, constraints and deliverables.
Develop schematic and PCB layout to scope.
Run checks and address feedback.
Package approved files and documentation.